Our services in product operations help the customers in smooth transition from design to manufacturing. We provide following services in product operations:

Design for excellence: Our services in CAD Design Engineering provides customers to build their product with increased manufacturability, quality and higher reliability. We focus on key areas of product development cycle to ensure successful manufacturing of the product. Our services in design for Excellence (DFx).

Test ability
Assembly
Manufacture ability
Fabrication
ECAD
MCAD

PCB Design:

We provide end to end solution on PCB design requirements, to various customers which helps the customers to accelerate their product development cycle. PCB design team of InESS has in-depth knowledge in PCB design process right from library to fabrication. InESS delivers Schematics and PCB design services on industry leading tools such as Cadence, OrCAD and Mentor.

Library Management:

Customized services for the Library Parts Development for both Schematic and Layout IEEE, IPC and customer specific standard.

Schematics Capture:

Schematic creation from hard copy to customer specific requirements. Net list creation/check.

PCB Layout:

High Speed digital, Analog, Mixed and RF designs High Layer count (36 layers) High density designs. Impedance/Delay matching mechanically constrained PCBs Impedance controlled Designs with delay matching, Stack-up and material selection. Expertise in Designs with Micro Vias, Blind Vias, Buried Vias and back drill. Fine Pitch BGA (0.5mm), High Pin count BGA (1764 pins) Expertise on Mentor Graphics and Cadence tools Integrating Mechanical & Electrical CAD data for assembly verification Design for Test ability (DFT), Manufacture ability (DFM) and service ability.

PCB Re-engineering:

Creation of Schematic, Board and the Gerber from the existing Gerber and Physical Board Conversion of design files from one CAD file to others.

Our services in supply chain management are :

Crimping Terminals Onto Cut And Stripped Wires

Achieving a quality crimp onto a stripped wire is always the desired result of any good wiring harness manufacturer. The best way to achieve quality is to make sure first that the wire itself is stripped properly and not missing any strands of copper that might have been removed or damages by the stripping process. another consideration is the length of the strip and even cutting of the wire sets up the correct situation for crimping properly.

Each different type of crimp terminal has a specified wire strip length that should be adhered to. These specifications are usually found in the crimp terminal supplier catalogue either online or hard copy book.

Crimped wires should be inspected carefully 3 different ways to verify the manufacturing process.

1. Crimp height is measured and verified in spec to manufacturer recommendations

2. Pull test either performed as a destructive test or a pull and hold for a period of time (usually one minute) is performed to measure the force necessary to pull apart the crimp.

The non destructive hold for a minute test is just that, and then the crimped wire can be returned to the production run.

3. Visual inspection of the crimped wire should also be done by a trained press set up operator who knows what a properly crimped terminal should look like. This is especially important for “F” type crimps.

Of course it goes without saying that measurements should be documented in some format and kept for reference by the wire harness manufacturing quality system.

At C-T Wire Prep Inc. we perform these press setups on a daily basis as we manufacture various wiring harnesses and cable assemblies.

Adhesive and Tapes

Electronic Components

Equipments

Our Products:

Semiconductor IC's

• MemoryFlash Memory,SDRAM,DDRSDRAM,Memory Cards
• Linear IC'SSeriesRegulator, SwitchingRegulators
• Clocks&TimerPLL, Buffer, Clock driver
• Logic&Multiplexer and SwitchDriver, Logic Gates, Mux/Demux, Bus switch
• Power ManagementWatchdog timer,Voltage detectors,LDORegulator, Battery Management
• Sensors & MEMSHall IC's, Optical Proximity Sensor, Temperature Sensor, Touch Screen controller
• Data ConvertersA/D Converter, D/A Converter
• InterfaceIC Card Interface, LVDSInterface IC's,Timing Controller, LineTransceiver, isolator
• Discrete Semiconductor
• TransistorsMOSFET, BipolarTransistor,Transistor Array
• DiodesSchottky Barrier Diodes, Rectifier Diodes, Fast Recovery Diodes, Zener Diodes, Switching Diodes, High Frequency Diodes, LED's,Power Devices

Passive Components Resistors Thick Film, Thin Film, Low Ohm, Current Sense,Resistor Networks CapacitorsMLCC,Tantalum, Electrolytic

CONNECTORSPCB Connectors, CABLE Connectors, I/O Connectors, Cable Assemblies, Housings

• Modules and sub systemsPower Modules,Wireless Modules

We provide consultancy services in